Intel’s Foveros 3D Chip Stacking Redesigns Chip Making Process

Only when designers and engineers thought that cramming transistors with each other is next to impossible, and the decade would possibly see the end of Moore’s Law, Intel has shown the light at the end of the tunnel. At Intel’s “Architecture Day,” the company unveiled a 3D packaging technology, called “Foveros,” that will allow it to stack […]

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Intel’s Foveros 3D Chip Stacking Redesigns Chip Making Process
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